Alumni Faculty

Biography

Professor Budiman is at the forefront of nanomechanics research where the classical worlds of mechanics intersect with the new realms of nanomaterials opening up exciting possibilities and startling novel technologies in the next generations of micro/nano-electronics and devices as well as advanced renewable energy systems (nuclear, extreme environments and solar photovoltaics). Utilizing the one-of-a-kind, powerful high spatial resolution white-beam capabilities of the synchrotron-based submicron X-ray diffraction to elucidate unique behaviors of nanoscale and advanced materials, Professor Budiman is one of the world’s leading experts in mechanics and reliability of advanced/nanoscale materials and cutting-edge semiconductor/energy devices. His seminal contributions include groundbreaking publications in the electromigration in copper interconnects for advanced microelectronics devices, providing key evidences of why “smaller is stronger” in crystalline nanomaterials and most recently first in situ stress characterization in Through-Silicon Via (TSV) enabling 3D chip technology. Dr. Budiman widely consults for some of the top semiconductor/energy technology companies in the world and is regularly invited to give seminars/lectures in premier international conferences/workshops as well as contribute book chapters in the subjects.

Having been trained in mechanical engineering, Professor Budiman earned his Ph.D. in Materials Science and Engineering from Stanford University in 2008 under the guidance of Professor William D. Nix (Von Hippel Award, Materials Research Society 2007) – arguably, the father of the famed “smaller is stronger” discovery. During his doctoral candidacy, Dr. Budiman received several research awards and contributed to several high-impact journal publications. He gave two symposium-invited talks in MRS (Materials Research Society) Spring and then Fall meetings of 2006 as a graduate student. He was then the recipient of the prestigious Los Alamos National Laboratory (LANL) Director’s Research Fellow Award in 2009 to conduct top strategic research for the energy and national security missions of the Los Alamos National Laboratory’s as a postdoctoral research fellow. In between these academic milestones, Dr. Budiman has also extensively worked with some of the largest and most successful technology companies in Silicon Valley in various capacities from short-term engineering stints, full-time technical staff positions to consulting/contracting engagements in both semiconductor/MEMS as well as energy/photovoltaics industries (Hewlett Packard, Intel Corporation, Advanced Micro Devices, Spansion, GlobalFoundries and SunPower Corporation). In addition, throughout his academic and technical careers, Dr. Budiman has deep, collaborative networks with energy-focused  U. S. national laboratories (Advanced Light Source, Berkeley Laboratory and Center for Integrated Nanotechnologies, Los Alamos National Laboratory).

Prof. Budiman’s work on thin silicon solar cell technology has recently received a Science Highlight from the famed Berkeley Lab for the technological breakthrough that has attracted wide industrial reception due to its strategic importance for the global solar PV industry:

http://www-als.lbl.gov/index.php/science-highlights/industry-als/829-improving-thin-silicon-solar-cell-technology.html

This is the second time Prof. Budiman’s group has been highlighted by Berkeley Lab in the past 3 years. His research on nanomechanics has also attracted significant interests from the nanotechnology community in Silicon Valley:

http://www-als.lbl.gov/index.php/holding/385-mechanical-behavior-of-indium-nanostructures.html

Education

• Ph.D. Materials Science & Engineering, Stanford University, CA
• MS Materials Science & Engineering, Stanford University, CA
• M.EngSc Materials Engineering, Monash University, Australia
• B.Eng (Hon) Mechanical Engineering, Institute of Technology, Bandung (ITB), Indonesia

Research

• Nanomaterials characterization
• Nanomechanical behaviors of materials
• Advanced structural and functional materials design for next generation energy technologies
• Design and materials for extreme environments (energy, military, aeropace applications)
• Design for reliability of advanced devices/systems (micro/nanoelectronics, energy/solar PV, etc.)
• Design and integration of advanced architecture for 3D IC (integrated circuit) technologies

Awards and Honors

• Berkeley Science Highlights: Enabling Thin Silicon Solar Cell Technology, 2013
• Elected Director to 2013 AVS Thin Film Users Group Board of Planning Committee
• Berkeley Science Hightlights (Lawrence Berkeley National Laboratory – Advanced  Light Source), 2010
• Los Alamos National Laboratory (LANL) Director’s Postdoctoral Research Fellow Award, 2009
• MRS Graduate Student Award (Silver Medal): Materials Research Society (MRS) Fall Boston 2006
• Graduate Student Best Paper Award: MRS Spring 2006
• SRC (Semiconductor Research Corporation)/Intel Corporation Master Scholarship 2004
• HP Invention Award, U.S Patent (No. 6,454,955), Hewlett-Packard Company 2001
• AusAID Scholar (Recipient of premier Australian government’s scholarship) 1996

Selected Publications

1. A.S. Budiman, H-A.-S. Shin, B.-J. Kim, S.-H. Hwang, H.-Y. Son, M.-S. Suh, Q.-H. Chung, K.-Y. Byun, N. Tamura, M. Kunz, Y.-C. Joo. Measurements of Stresses in Cu and Si around Through-Silicon Via by Synchrotron X-Ray Microdiffraction for 3-Dimensional Integrated Circuits. Microelectron. Rel. 52, p. 530-533, 2012
2. A. S. Budiman, S. M. Han, Q. Wei, P. Dickerson, N. Tamura, M. Kunz, A. Misra. Plasticity in the Nanoscale Cu/Nb Single Crystal Multilayers as Revealed by Synchrotron X-Ray Microdiffraction.J. Mater. Res. 27, p. 599-611, 2012
3. A. S. Budiman, G. Lee, M. J. Burek, D. Jang, S. M. Han, N. Tamura, M. Kunz, J. R. Greer, T. Y. Tsui. Plasticity of Indium Nanostructures as Revealed by Synchrotron X-Ray Microdiffraction. Mater. Sci. Eng. A 538, p. 89-97,2012
4. A. S. Budiman, N. Li, J. K. Baldwin, J. Xiong, H. Luo, Q. Wei, N. Tamura, M. Kunz, K. Chen, A. Misra. Growth and Structural Characterization of Cu/Nb Single Crystal Multilayers for in situ Synchrotron Laue X-Ray Microdiffraction Studies. Thin Solid Film  519, p. 4137-4143, 2011
   
5. A. S. Budiman, P. R. Besser, C. S. Hau-Riege, A. Marathe, Y. -C. Joo, N. Tamura, J. R. Patel and W. D. Nix. Electromigration-induced Plasticity: Texture Correlation and Implications for Reliability Assessment. J. Electron. Mater.38, iss. 3, p.379-391, 2009. (J.E.M. Editor’s Choice Paper)
6. A. S. Budiman, S. M. Han, J. R. Greer, N. Tamura, J. R. Patel and W. D. Nix. A Search for Evidence of Strain Gradient Hardening in Au Submicron Pillars under Uniaxial Compression Using Synchrotron X-Ray Microdiffraction. Acta Mater.,56, p. 602-608, 2008
   
7. A. S. Budiman, N. Tamura, B. C. Valek, K. Gadre, J. Maiz, R. Spolenak, W. D. Nix and J. R. Patel. Crystal Plasticity in Cu Damascene Interconnect Lines Undergoing Electromigration As Revealed by Synchrotron X-Ray Microdiffraction. App. Phys. Lett., 88, p. 233515, 2006

Other Scholarly Accomplishments

Book Chapters

1. Arief Suriadi Budiman. Chapter X: Evolution of Microstructure in Copper Interconnects during Electromigration, in “Electromigration in Thin Films and Electronic Devices: Materials and Reliability,” edited by C.-U. Kim, ISBN: 978-1-84569-937-6, Woodhead Publishing, p. 135-189, 2011.
2. Arief Budiman Suriadi, V. Sharma, B. Wieder and G. Mittendorfer. Chapter XI: Spray Coating Technology of Photoresist/Polymer for 3-D Patterning and Interconnects, in “Materials and Process Integration for MEMS (Microsystems),” edited by F. E. H. Tay, ISBN 1-4020-7175-2, Kluwer Academic, p. 205-229, 2002.

Patents

1. U.S. Patent No. 6,454,955, “Electrical Interconnect for an Inkjet Die,” Hewlett-Packard Co., Palo Alto, CA
2. U.S. Patent No. 6,692,111, “Electrical Interconnect for an Inkjet Printhead Comprising an Ink-Ejecting Semiconductor Die,” Hewlett-Packard Co., Palo Alto, CA
3. U.S. Patent Publication No. US 2006/0028908, “Micro-mixer,” Hewlett-Packard Co., Palo Alto, CA